Power integration electrical

A practical, application-oriented text that presents analytical results for the better modeling and control of power converters in the integration of green energy in electric power systems The combined technology of power semiconductor switching devices, pulse width modulation algorithms, and control theories are being further developed along with the performance improvement of power semiconductors and microprocessors so that more efficient, reliable, and cheaper electric energy conversion can be achieved within the next decade. Integration of Green and Renewable Energy in Electric Power Systems covers the principles, analysis, and synthesis of closed loop control of pulse width modulated converters in power electronics systems, with special application emphasis on distributed generation systems and uninterruptible power supplies.

The authors present two versions of a documented simulation test bed for homework problems and projects based on Matlab/Simulink, designed to help readers understand the content through simulations. The first consists of a number of problems and projects for classroom teaching convenience and learning.

The second is based on the most recent work in control of power converters for the research of practicing engineers and industry researchers. Addresses a combination of the latest developments in control technology of pulse width modulation algorithms and digital control methods Problems and projects have detailed mathematical modeling, control design, solution steps, and results Uses a significant number of tables, circuit and block diagrams, and waveform plots with well-designed, class-tested problems/solutions and projects designed for the best teaching-learning interaction Provides computer simulation programs as examples for ease of understanding and platforms for the projects Covering major power-conversion applications that help professionals from a variety of industries, Integration of Green and Renewable Energy in Electric Power Systems provides practical, application-oriented system analysis and synthesis that is instructional and inspiring for practicing electrical engineers and researchers as well as undergraduate and graduate students.

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author\'s extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling.

In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility.

Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.